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Thermalright Extreme Odyssey Thermal Pad 12.8 W/mK, 120x20x0.5mm


After THERMALRIGHT launched high-quality thermal grease, it was highly praised. We adopted new technology to make it easy for all players to use our thermal pad. This Odyssey thermal pad is rated voltage up to 9.8KV and has a thermal conductivity of 12.8 W/mk and insulation. It is safe to use without electricity. This thermal pad is very versatile and easy to use. Example: Notebook computers, Graphics Cards, DRAM memory modules, communication devices, SSD solid state hard drives, car control devices and game equipments, etc.


Product Description

12.8 W/mK Thermal Conductivity


  • Main Features
  • Thermal pad has 12.8 W/mK Thermal Conductivity, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect. At the same time, the thermal pad also has Insulation, Non-conductive, wear-resistant, fire-retardant, compression, buffering, no damage to metal materials, etc effect.
  • Why use thermal silicone Pad ?
  • The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;
  • because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface, And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;
  • with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact, Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.
  • Applicable industry: LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV, communications industry, Industrial industry, household electrical appliance industry.
  • Scope Application: electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high power LED lighting, Car machine, power devices, automotive electronic modules (engine scrubber) Power modules, high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation

Product Description

Thermal Conductivity(W / m-k):12.8 W/mk
Specifications:120×20 mm
Breakdown Voltage:9.8KV
Electrically Conductive:NO
Thermal Pad Thickness:0.5 mm

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